Aluminum Nitride Nanopowder

The general property and features of this product is that it is hard, high modulus, high dielectric, refractory, anti thermal shock, lower thermal expansion compatible with Silicon, excellent thermal conductivity. The nanopowder provides lower sintering temperature and higher strength & ductility from the compaction.This powder may be applied for the integrate circuit substrate, electronic devices, optical devices, thermal conductive devices, crucibles, composites with metal matrixes and polymer matrixes, the high temperature seal binders and electronic encapsulation materials.
Notes: The nanopowder needs to avoid direct sunshine. Moisture will result for agglomerations. Water is not recommended as dispersant without encapsulation.

Aluminum Nitride Nanopowder
97-99% , 10-20nm
Chemical formula: AlN
Purity: 97.5-99%
[O] < 1%
APS: 10-20 nm
SSA: 115 m2/g
True density: 3.26 g/cm3
Bulk density: 0.12 g/cm3
Crystal cell: Hexagonal
Color: Off White
Surface: Water-reactive

Aluminum Nitride Nanopowder may be utilized for the integrate circuit substrate, electronic devices, optical devices, thermal conductive devices, crucibles, composites with metal matrixes and polymer matrixes, the high temperature seal binders and electronic encapsulation materials.

From:http://www.nano-powders.net/Nitrides/Aluminum-Nitride-Nanopowder/